A proof of concept demonstration of the PROFINET@OPC UA Companion Specification will be shown at SPS/IPC/Drives 2018, and is scheduled for release at Hannover Fair 2019. It is based on the “Facet Modeling” concept to help enable the movement of semantic information.
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Author: Michael Bowne
Want to learn more about integrating PROFINET with TSN and OPC UA? How do sensors gain the ‘smart factor’ by using IO-Link? What does PI’s new “Industry 4.0 Demonstrator” entail? Find out by visiting PI in Hall 5 Booth 210!
There are still training opportunities left in 2018. Find a course in your region and get educated. Many courses have been approved by PI, using accredited trainers, content, and learning outcomes. Register today!
Are you aware of the many freely downloadable documents on the profibus.com website? From guidelines, to system descriptions, to brochures, all topics are covered in a range of depths from introductory to advanced.
2019 is shaping up to be a very big year –at least it is for PROFIBUS/PROFINET International (PI). With a number of major releases planned, now is the time to familiarize yourself with three major technological advancements that are finally coming into reality.
The announcement comes roughly one year after Emerson’s failed bid to acquire Rockwell Automation. With the acquisition, Emerson can now offer solutions into discrete manufacturing markets, adding to its existing process control solutions.
PI offers many different levels of training and events to learn about PROFIBUS, PROFINET and IO-Link. From the introductory up to the advanced, PI events are intended to be educational and informative. This month we highlight some of PI’s no-cost events going on around the globe.
You may find the expression “wireless wire manufacturer” an odd play-on-words, but wait until you discover what lies beneath it. They are employing state-of-the-art wireless technology for manufacturing cables.