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Author: Nelly Ayllon
Generally, development tends to be faster for new devices if the wheel isn’t reinvented each time. The Easy Way to PROFINET brochure offers an overview of the development process and provides a list of solution providers for PROFINET integration.
Concepts like TSN and OPC UA are making headlines and the race is on to leverage each in order to gain a sustainable competitive advantage for Industrie 4.0. There’s no silver bullet, but PROFINET plays a key role. Learn more about the Industry Foursight™ initiative…
For training classes, marketing, sales, or just for your own knowledge – PI has published many new freely downloadable documents. Check them out!
On March 19th PI North America with PICC/PITC Argentina will be hosting their first webinar in Spanish language. The webinar will be an introduction to PROFIBUS. Register today and share with your colleagues / Regístrese hoy e invite a sus colegas.
Planning a development roadmap for a PROFINET project is critical for a smooth process and on-time product release. There are a few basic steps that you should follow. This article will guide you through the process to develop a successful roadmap!
[email protected] has already become a reality. The first chip vendors have implemented TSN in PROFINET. A live demo at SPS IPC Drives 2018 displayed solutions from three different manufacturers: Texas Instruments, Analog Devices, and Hilscher.
The PROFIsafe for OPC UA collaboration began at SPS IPC Drives 2017. In less than a year, the joint working group has managed to draft a review version of the specification “Safety over OPC UA Based on PROFIsafe” for controller-to-controller communication.