The intelligent manufacturing networks of digital factories will only become reality with machine-processable, standardized information. PI sees its role in creating the necessary basis for this fact, especially in view of Industry 4.0. Learn about the collaboration of eCl@ss and PI and how it enables consistent data models.
A proof of concept demonstration of the PROFINET@OPC UA Companion Specification will be shown at SPS/IPC/Drives 2018, and is scheduled for release at Hannover Fair 2019. It is based on the “Facet Modeling” concept to help enable the movement of semantic information.
Several exciting new products to announce this month for PROFIBUS and PROFINET. Schildknecht, MESCO, Siemens, Softing, and Vivace launch new products.
Want to learn more about integrating PROFINET with TSN and OPC UA? How do sensors gain the ‘smart factor’ by using IO-Link? What does PI’s new “Industry 4.0 Demonstrator” entail? Find out by visiting PI in Hall 5 Booth 210!
The IO-Link Community met for joint testing at an IO-Link Plugfest at Festo last month. The event was a total success! Nearly 90 participants brought their latest products.
When speaking about wireless PROFINET communications for industrial automation, there are a variety of architectures available depending on the application. Overall, there are 4 main possible architectures: P2P, P2M, WDS, and Mesh.
There are still training opportunities left in 2018. Find a course in your region and get educated. Many courses have been approved by PI, using accredited trainers, content, and learning outcomes. Register today!
Are you aware of the many freely downloadable documents on the profibus.com website? From guidelines, to system descriptions, to brochures, all topics are covered in a range of depths from introductory to advanced.