PROFINET, PROFIBUS, and IO-Link news from around the world

30 Years of PI

30 years ago, in December 1989, PI was founded out of a research project, funded by the German government. What happened afterward is well known. A success story in industrial automation.

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PROFINET: The World’s Leading Industrial Ethernet Solution

Get up to date with the latest research from IHS Markit | Technology. Findings show the adoption of PROFINET in the industry. In terms of newly connected nodes, PROFINET represented a market share of nearly 30% in 2018, making it the world’s leading Ethernet-based communication solution for industrial automation.

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IODDfinder – The Smart Solution

It does not get easier than this. With the IODDfinder, files arrive from the Internet automatically – no fuss, no muss. This Internet platform for IO-Link description files – has become an established name in the market in just three years.

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SPS 2019 Wrap-Up and a Look to 2020

Under the new name 'Smart Production Solutions', SPS Fair 2019 was again a big success. The name change reflects the ongoing digital transformation and therefore the convergence of IT and OT. Many IT companies appeared at the fair to showcase their IoT solutions. It was a perfect setup for PI and our booth.

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Moving Forward: Advanced Physical Layer for Industrial Ethernet

The FieldComm Group, ODVA, and PI announce that Emerson has joined the APL Project as an industry partner. The project’s goal is to develop an advanced physical layer for Industrial Ethernet, suitable for use in demanding applications in process instrumentation. Key updates in the development of the technology have been achieved this month.

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Next Steps Along the “PROFINET over TSN” Roadmap

Since the PROFINET specification V2.4 was released with integrated TSN functionality, PI has consistently been working on the implementation of further components for a successful market launch – upholding their motto, “Go digital. Go PROFINET.” PI’s I4.0 strategy is clear; TSN will be advantageously utilized as a future-proof common Layer 2 technology for PROFINET communication.

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