PROFINET, PROFIBUS, and IO-Link news from around the world

SPS 2019 Wrap-Up and a Look to 2020

Under the new name 'Smart Production Solutions', SPS Fair 2019 was again a big success. The name change reflects the ongoing digital transformation and therefore the convergence of IT and OT. Many IT companies appeared at the fair to showcase their IoT solutions. It was a perfect setup for PI and our booth.

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Moving Forward: Advanced Physical Layer for Industrial Ethernet

The FieldComm Group, ODVA, and PI announce that Emerson has joined the APL Project as an industry partner. The project’s goal is to develop an advanced physical layer for Industrial Ethernet, suitable for use in demanding applications in process instrumentation. Key updates in the development of the technology have been achieved this month.

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Next Steps Along the “PROFINET over TSN” Roadmap

Since the PROFINET specification V2.4 was released with integrated TSN functionality, PI has consistently been working on the implementation of further components for a successful market launch – upholding their motto, “Go digital. Go PROFINET.” PI’s I4.0 strategy is clear; TSN will be advantageously utilized as a future-proof common Layer 2 technology for PROFINET communication.

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Ethernet to Field Instruments in the Process Industry

Ethernet-APL (Advanced Physical Layer) improves the value creation of your process system through the use of Internet technology and high-speed communication down to the field level. As a result, the installation, configuration and maintenance of instruments and automation technology are greatly simplified.

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Tapping Shop-Floor Data

At this year’s PI Konferenz in Frankfurt, a user complained that approximately 90% of the data accrued in today’s production process remains untapped. PROFIBUS & PROFINET International is tackling this problem by standardizing the interfaces and data coming from devices, cells, or machines.

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Trends to Watch in 2020 and Beyond

Understanding how the ‘black channel principle’ ensures safety-related messages get from their source to their destination and IO-Link’s role in simplifying the sensor-to-cloud connection are two trends to watch in 2020 and beyond.

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