The FieldComm Group, ODVA, and PI announce that Emerson has joined the APL Project as an industry partner. The project’s goal is to develop an advanced physical layer for Industrial Ethernet, suitable for use in demanding applications in process instrumentation. Key updates in the development of the technology have been achieved this month.

Since the PROFINET specification V2.4 was released with integrated TSN functionality, PI has consistently been working on the implementation of further components for a successful market launch – upholding their motto, “Go digital. Go PROFINET.” PI’s I4.0 strategy is clear; TSN will be advantageously utilized as a future-proof common Layer 2 technology for PROFINET communication.

In cooperation with the OPC Foundation, PI has completed the technical work for "OPC Unified Architecture, Part 15: Safety". It allows for vendor-neutral failsafe machine-to-machine communication that until now had been missing.

Since 2006, the PROFINET Security Guideline has described the technical and procedural measures on the part of the manufacturer and users of PROFINET devices. PI is now developing supplemental measures to also protect PROFINET at the protocol level.

Ethernet-APL (Advanced Physical Layer) improves the value creation of your process system through the use of Internet technology and high-speed communication down to the field level. As a result, the installation, configuration and maintenance of instruments and automation technology are greatly simplified.

At this year’s PI Konferenz in Frankfurt, a user complained that approximately 90% of the data accrued in today’s production process remains untapped. PROFIBUS & PROFINET International is tackling this problem by standardizing the interfaces and data coming from devices, cells, or machines.

Understanding how the ‘black channel principle’ ensures safety-related messages get from their source to their destination and IO-Link’s role in simplifying the sensor-to-cloud connection are two trends to watch in 2020 and beyond.