Frank Moritz, Executive Board member for PI International, shares his insights on the potential for IO-Link Safety and why it is the next logical step in the evolution of IO-Link technology.
With the market beginning to see the value and benefit of Ethernet-APL, the core features of PROFINET – stable communication, high availability, fast configuration, and improved fault diagnostics – are being put to use on instrumentation in the field of process plants.
Check out all the great updates to the PROFINET Community Stack, including a demo application to help make integration easier.
SXP is a new protocol that will be integrated into the PROFINET stack version 2.5. A new SXP Demo has been developed to help device manufacturers and solution providers understand this technology.
With the EU Cyber Resilience Act (CRA) starting in December 2027, PROFINET has developed a scalable approach to meeting security requirements. Read about how the PROFINET architecture covers the entire security spectrum: from network segmentation to cryptographically-secured real-time communication.
Module Type Package (MTP) Specification 2.0 provides significant functional enhancements and represents an important milestone for modular automation. Check out what MTP 2.0 brings to industry.
How can even the smallest sensors communicate intelligently? For almost 20 years, IO-Link has provided compelling answers. The recipe for success: simple application combined with innovation.
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