PI Standardizes Ethernet in Process Automation

A new physical layer – known as APL (Advanced Physical Layer) – is being created for Ethernet-based communication in the field. As part of a joint project by well-known industrial companies and organizations, PI is taking the leading role.

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The Future Starts Today

Our future-proof TSN strategy is based on consistent day-to-day work -not marketing speak. This is real, it's happening, and we're working harder than anyone to make the future a reality.

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Understanding the IIoT Hype Cycle

To avoid all the hype and implement solutions that solve real world problems, it's time to focus on actual use cases. Developing standards solely for technology’s sake only exacerbates potential peaks and troughs in the hype cycle of the IIoT.

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Join Us at SPS/IPC/Drives: November 28-30

The joint PI booth will have several new features at this year’s SPS/IPC/Drives in Nuremberg, Germany on November 28–30, 2017. We have a new, larger position still located centrally in Hall 2. Visit us!

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Edge Computing: A Competing View

There still remains a lot of discussion about what “edge computing” really means. At its core, it’s more about how control technologies are used than what they do.

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Integrating IO-Link into OPC UA

Is there a transparent and standardized way to move data from "sensor to the cloud"? A companion specification between IO-Link and OPC UA will help solve this problem. An IO-Link workshop is scheduled for October 11th in Turin, Italy.

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New PROFIdrive Profile Tester Available

A new and improved PROFIdrive profile tester is now available. Manufacturers building drives or encoders according to the PROFIdrive Application Profile now have an easy path to ensure conformity.

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PROFIsafe – a Key Ingredient Towards Successful Automation

How does open, integrated safety enable a competitive advantage versus traditional practices? And with the focus on safety increasing in recent years, is there a way to make safety easier to manage and deploy? Here follows a look at PROFIsafe -past, present, and future.

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