SPS 2019 Wrap-Up and a Look to 2020

Under the new name 'Smart Production Solutions', SPS Fair 2019 was again a big success. The name change reflects the ongoing digital transformation and therefore the convergence of IT and OT. Many IT companies appeared at the fair to showcase their IoT solutions. It was a perfect setup for PI and our booth.

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Moving Forward: Advanced Physical Layer for Industrial Ethernet

The FieldComm Group, ODVA, and PI announce that Emerson has joined the APL Project as an industry partner. The project’s goal is to develop an advanced physical layer for Industrial Ethernet, suitable for use in demanding applications in process instrumentation. Key updates in the development of the technology have been achieved this month.

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Next Steps Along the “PROFINET over TSN” Roadmap

Since the PROFINET specification V2.4 was released with integrated TSN functionality, PI has consistently been working on the implementation of further components for a successful market launch – upholding their motto, “Go digital. Go PROFINET.” PI’s I4.0 strategy is clear; TSN will be advantageously utilized as a future-proof common Layer 2 technology for PROFINET communication.

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Wireless PROFINET to Control a Giant Tunnel Boring Machine

Tunnel boring machines are enormous, highly automated, mobile "factories," which can perform all stages of tunnel construction in a single run. A challenge for these machines is the transmission of relevant data from the head to the controller located further back. PROFINET over wireless played a vital role in solving that challenge.

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