The experts of the PI Community enjoyed meeting their customers and interested parties in person at SPS on November 8-10, 2022. Covering an area of more than 260 m², new innovations were showcased at the joint booth of PROFIBUS & PROFINET International (PI) with numerous co-exhibitors.
With completion of the V2.4 MU3 documentation, the experts at PI finished the specification work for PROFINET over TSN in mid 2022. The scope and depth of all the required TSN functions and the corresponding configuration using PROFINET resources are described in detail.
The signing of PROFINET GSDML files by a device manufacturer ensures both authenticity and integrity, i.e. the GSDML file has been created securely by the responsible device manufacturer and has not been tampered with on the way to the user. The end result is a GSDX secured file.
omlox V2.0 now also includes support for IEEE 802.15.4z in the Ultra-Wideband (UWB) range. This is another milestone in the technological development of omlox, as it makes the standard compatible with the UWB chips used in the consumer smartphone industry.
With the SPS tradeshow, there is a wave of new products to announce this month from: Turck, Omron, LAPP, KUNBUS, HMS Networks, CoreTigo, BEx-Solution, and Baumer.
The latest IO-Link device developments were tested with regard to the interface itself, as well as cross-system integration into a variety of different engineering tools. Also included in the testing was data transfer and data visibility across all layers up to the cloud.
After heat dissipation, size is the next biggest concern for all industrial sensors, and it applies as well to new IO-Link sensors. The newest generation of transceivers recognize the need to integrate both the protection and a high-efficiency DC-DC buck regulator to further reduce the size and the heat dissipation of the sensor subsystem.
In more and more cases, the ability to communicate and interoperate via PROFINET is a must-have for Industry 4.0-capable devices. What should device manufacturers know to make the right “make-or-buy” decision?