omlox V2.0 now also includes support for IEEE 802.15.4z in the Ultra-Wideband (UWB) range. This is another milestone in the technological development of omlox, as it makes the standard compatible with the UWB chips used in the consumer smartphone industry.

The latest IO-Link device developments were tested with regard to the interface itself, as well as cross-system integration into a variety of different engineering tools. Also included in the testing was data transfer and data visibility across all layers up to the cloud.

Helping bridge the gap to Time Sensitive Networking adoption by easing the integration effort for automation vendors is a key focus for PI. We're attacking this two ways: with a PROFINET Community Stack and with simplified device certification testing.

Does PROFINET work over 5G? Can failsafe applications be used? What level of performance can be expected? The testbed developed by ifak, HMS, NXP, and Radisys implemented a PROFINET network over 5G to answer these very questions.

IO-Link Safety is very powerful and is used for safe drives, door locks and control & signaling device boxes, among other things. See the first multi-vendor demo with IO-Link Safety live at the joint PI stand at the SPS trade fair in Nuremberg, Germany (Hall 5, 210).

This month's issue of PROFINEWS places the focus squarely on the use of PROFINET in the process automation industry. From Ethernet-APL, to PROFIsafe, to Module Type Package (MTP), to the PA Profile, PI's technologies are making inroads like never before.

PROFIsafe and Ethernet-APL complement each other perfectly. With their combination, PI meets the challenge of providing both safety and non-safety applications through a unified PROFINET infrastructure.

ISA100 WCI, NAMUR, ODVA, PI, VDMA, and ZVEI plan to partner with FieldComm Group and OPC Foundation to collaboratively develop the Process Automation Device Information Model (PA-DIM) standard.