PROFINET, PROFIBUS, and IO-Link news from around the world

2017 Recap: TSN, OPC UA, & PROFINET

"The new PI booth had around 100 co-exhibitors, which shows the importance that members attribute to PI. Vendors, chip-manufacturers, or service-providers: they all see the value in being part of PI’s global community" commented Karsten Schneider, PI Chairman, after the SPS/IPC/Drives 2017 fair.

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PROFIsafe for OPC UA

PROFIsafe mechanisms are extending to OPC UA: users will benefit from an open technology and cross-manufacturer communication at the control level for both standard and safety-related data.

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The Future Starts Today

Our future-proof TSN strategy is based on consistent day-to-day work -not marketing speak. This is real, it's happening, and we're working harder than anyone to make the future a reality.

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Understanding the IIoT Hype Cycle

To avoid all the hype and implement solutions that solve real world problems, it's time to focus on actual use cases. Developing standards solely for technology’s sake only exacerbates potential peaks and troughs in the hype cycle of the IIoT.

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