"The new PI booth had around 100 co-exhibitors, which shows the importance that members attribute to PI. Vendors, chip-manufacturers, or service-providers: they all see the value in being part of PI’s global community" commented Karsten Schneider, PI Chairman, after the SPS/IPC/Drives 2017 fair.
PROFIsafe mechanisms are extending to OPC UA: users will benefit from an open technology and cross-manufacturer communication at the control level for both standard and safety-related data.
PI is working towards a new paradigm... Time Sensitive Networking (TSN) integration into PROFINET. In the context of Industry 4.0, TSN is a hot topic and an opportunity for better integration of OT networks into the IT networks of companies.
A lot of preparatory work has already been performed on the following use-cases: Asset Management and Diagnostics. Eventually, the activities aim to create a PROFINET + OPC UA companion specification by mid-2019.
A new physical layer – known as APL (Advanced Physical Layer) – is being created for Ethernet-based communication in the field. As part of a joint project by well-known industrial companies and organizations, PI is taking the leading role.
Our future-proof TSN strategy is based on consistent day-to-day work -not marketing speak. This is real, it's happening, and we're working harder than anyone to make the future a reality.
To avoid all the hype and implement solutions that solve real world problems, it's time to focus on actual use cases. Developing standards solely for technology’s sake only exacerbates potential peaks and troughs in the hype cycle of the IIoT.
The joint PI booth will have several new features at this year’s SPS/IPC/Drives in Nuremberg, Germany on November 28–30, 2017. We have a new, larger position still located centrally in Hall 2. Visit us!