Upcoming IO-Link Events: June 2023
On June 13th a no-cost IO-Link user workshop will be held in Greenville, SC, USA. On June 21st the IO-Link Members Assembly will be held in Bad Soden, Germany. Register today and join us.
On June 13th a no-cost IO-Link user workshop will be held in Greenville, SC, USA. On June 21st the IO-Link Members Assembly will be held in Bad Soden, Germany. Register today and join us.
Companies with new products to announce this month include: Rockwell Automation, Alicat Scientific, Sewio, Indu-Sol, Gefran, WAGO, and Pepperl+Fuchs. Find out what's available.
Xaver Schmidt (Siemens AG) was newly elected as the Chairman of the Board of Directors. Prof. Dr. Felix Hackelöer (TH Köln/Gummersbach) and Harald Müller (Endress+Hauser) were also newly elected as board members. Frank Moritz (Sick AG) was re-elected to the Board of Directors.
At the Hanover Fair, PI is demonstrating how modular automation units can be integrated into a higher-level process control or SCADA system within minutes using Module Type Packages (MTP).
New IO-Link devices to announce this month include: flowmeters from VSE; vacuum pumps from Corval; temperature transmitters from Omega; and contrast sensors from Leuze. Also announced are IO-Link masters from Turck, and Field Data Enablement from SIEMENS via PROFINET.
On Thursday March 30, 2023, PI North America hosted its first IO-Link User Workshop in the United States. The event was held in Auburn Hills, MI and was a huge success, attended by over 120 people.
At last months PI Konferenz, more than 350 participants discussed trends and challenges in communications technology in Frankfurt, Germany. It has become increasingly evident that the digital transformation in industrial environments simply won't work without PI's technologies.
Will we ever see ‘one network to rule them all’? Perhaps. It certainly would be an elegant solution. But it begs the question: would it be practical? So, perhaps not. In the meantime we're beginning to combine technologies to solve unique use-cases.